@INPROCEEDINGS {36393,
author={P.  Bouça},
doi={},
booktitle={IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies IMWS-5G},
title={Mutual Coupling Reduction Using Grounded Copper Vertical Plane Structure},
year={2018},
month={August},
volume={},
pages={-} 
}