@ARTICLE {5965,
author={T.R. Cunha and H. Teixeira and J. C. Pedro and I. S. Stievano and L. Rigazio and F. Canavero and R. Izzi and F. Vitale and A. Girardi},
doi={10.1109/TCPMT.2011.2158313},
journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
title={Validation by measurements of an IC modeling approach for SiP applications},
year={2011},
month={August},
volume={1},
number={8},
pages={1214-1225},
ISSN={2156-3950}
}