Creating and sharing knowledge for telecommunications

Millimeter-Wave In-Package Antennas

on 22-11-2018


Prof. Zhang Yue Ping, from the Nanyang Technological University, Singapore

Date & time: Thursday, November 22nd, 11:00h – 13:00h
Location: Instituto Superior Técnico, Meeting Room, 5th floor, Torre Norte

Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device. AiP technology has been widely adopted by chip makers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. This lecture will start with a review of basic packaging ideas for AiP technology, particularly on the co-design of antennas and packages, complemented by a probe-based setup to measure impedance and radiation of mmwave in-package antennas. Finally, the lecture will present some recommendations on research topics to further the state of the art of AiP technology.

Zhang Yue Ping is a full Professor of Electronic Engineering with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S), and a Fellow of IEEE. Prof. Zhang has made pioneering and significant contributions to the development of the antenna-in-package (AiP) technology that has been widely adopted by chip makers for millimeter-wave applications. His current research interests include the development of antenna-on-chip (AoC) technology and
characterization of chip-scale propagation channels at terahertz for wireless chip area network (WCAN).

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