on 07-05-2023
Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.
In view of previous years' success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal, on 7-10 of May of 2023. The technical program will include both oral and poster sessions, and several prominent experts will give keynotes on emerging interest areas. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:
• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design
The Workshop Chairs:
Joana Catarina Mendes: Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia: Politecnico di Torino, Torino (ITA)
IMPORTANT DATES
• Full Paper Submission: January 31st, 2023
• Notification of Acceptance: March 15th, 2023
• Final Paper Submission: April 5th, 2023
• Early Bird Registration: April 5th, 2023
• Sponsors Registration: April 5th, 2023
• Student Awards Application: March 31st, 2023
Find more on the workshop webpage:
More Information..
on 22-06-2023
The ENBENG 2023 - 7th IEEE Portuguese Meeting on Bioengineering is back and will be held from 22-23 June 2023, in “Fundação de Serralves” and in the Faculty of Engineering of the University of Porto (FEUP), Portugal.
The IEEE EMBS Portugal Chapter has been organizing for several years the ENBENG, a biennial conference dedicated to the bioengineering & biomedical engineering scientific area. After a gap due to Covid-19, ENBENG will be back with an exciting conference program that will feature top-ranked keynote lecturers, invited sessions, oral and poster sessions, bioengineering companies engagement, and workshop sessions for students and bioengineering professionals.
This conference aims to promote bioengineering and Biomedical Engineering knowledge, raise national awareness of this field, and reinforce national cooperation between researchers, research groups, industry, and institutions working in these areas of interest.
All are encouraged to submit papers to be considered for presentation at the 7th ENBENG 2023.
Conference themes include (but are not limited to):
Biomedical Imaging and Image Processing;
Instrumentation and Biomedical Signal Processing;
Modeling Physiological Systems;
Biomechanics;
Neuroengineering and Neurosciences;
Rehabilitation Engineering;
Medical Robotics and Human-Machine Interfaces;
Stem Cell Biology and Regenerative Medicine;
Biomaterials and Tissue Engineering;
Bioinformatics and Systems Biology;
Biomolecular, Biocelular, and Bioprocess Engineering;
Health Informatics and Telemedicine;
Medical Equipment Management;
Wearable Biomedical Sensors and Systems;
Bioengineering Education and Society;
Biophysics;
Micro and Nano-Bioengineering.
Key Dates:
March 10, 2023 - Submission Deadline
April 28, 2023 - Accept/Reject Notification
June 1, 2023 - Early Bird Registration Close
June 15, 2023 - Standard Registration Close
June 22-23, 2023 - ENBENG Conference
For more information, please visit the conference webpage:
More Information..