Creating and sharing knowledge for telecommunications

Call for Papers - 27th Edition of SPI: IEEE Workshop on Signal and Power Integrity

on 07-05-2023

... Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of previous years' success, the Committees are hardworking and keen on the 27th Edition which will be held as an in-person event in Aveiro, Portugal, on 7-10 of May of 2023. The technical program will include both oral and poster sessions, and several prominent experts will give keynotes on emerging interest areas. Original and unpublished contributions on all aspects of Signal and Power Integrity are welcomed, related to the following topics of interest:

• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®). Authors of the best-ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology. Please visit for further information.

Students presenting a paper at the workshop may apply to the Student Awards. Please visit this next for further information:

(a) IEEE Electronics Packaging Society: Student Travel Grants
(b) IEEE SPI 2023: Best Student Paper

One of the goals for SPI 2023 is to provide an exceptional level of international exposure for Companies interested in sponsoring the event by promoting their products and services to all participants and significantly enhancing their visibility and reputation on Signal and Power Integrity expertise.

Registration for Sponsors is open! Please visit the next link for more on sponsorship conditions:

The Workshop Chairs:

Joana Catarina Mendes: Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia: Politecnico di Torino, Torino (ITA)

• Full Paper Submission: January 31st, 2023
• Notification of Acceptance: March 15th, 2023
• Final Paper Submission: April 5th, 2023
• Early Bird Registration: April 5th, 2023
• Sponsors Registration: April 5th, 2023
• Student Awards Application: March 31st, 2023

Find more on the workshop webpage:

More Information..